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addikt
ma jelentik be az AMD MI300 = Mesterséges Intelligencia 300 -at.
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azért ide is beposztolom ..
"AMD MI300 – Taming The Hype – AI Performance, Volume Ramp, Customers, Cost, IO, Networking, Software"
https://www.semianalysis.com/p/amd-mi300-taming-the-hype-ai-performance- Banff XCD ( GPU , ~ CDNA3 )
- DG300 Durango CCD ( CPU )"
The other modular compute aspect of MI300 is the CPU side. AMD partially reuses their Zen 4 CCD chiplet albeit with some modifications. They changed a few of the metal layer masks to create bond pads for SoIC to the AID, necessitating a new tapeout with some metal masks redesigned. This modified Zen 4 CCD, GD300 Durango disables the GMI3 PHY. The bandwidth to the AID is significantly higher than GMI3. This CCD is on TSMC’s 5nm process technology and retains the same ~70.4mm2 die size as the Zen 4 CCD found on desktop and server.
Each AID can have 3 Zen 4 chiplets for a total of 24 cores. The max CCD/CPU configuration of MI300 could offer up to 96 cores."
"MI300A is packaged with an integrated heat spreader on a 72 x 75.4mm substrate, and fits into socket SH5 LGA mainboards, with 4 processors per board. It effectively paid for the development costs. It is already shipping, but really ramps in Q3. The standard server/node will be 4 MI300A’s. There is no need for host CPU as that is built in. This is by far the best HPC chip on the market and will remain so for a while.
..
MI300X is the AI hyperscaler variant that if successful would be the real volume mover. It is all GPU, for maximum performance in AI. The server level configuration that AMD is pushing here is 8 MI300X’s + 2 Genoa CPUs.MI300C would go the opposite direction and be CPU only with 96-core Zen4 + HBM answer to Intel's Sapphire Rapids HBM. However, the market for this may be too small and the product too expensive for AMD to productize this variant.
MI300P is like a half sized MI300X. It is one that can come in at a lower power in PCIe cards. This again requires host CPUs. This would be the easiest one to get to start developing with, although we think that’s more of a 2024 release.
"
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