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• #236 Atti777 senior tag Zeratul #234

  Új Válasz 2015-08-26 22:07:12 #236

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  Atti777

  senior tag

  válasz Zeratul #234 üzenetére

  Igen.

  " The interposer is a simple silicon die, usually manufactured using an older and larger chip fabrication process
  ...
  the interposer is completely passive; it has no active transistors because it serves only as an electrical interconnect path between the primary logic chip and the DRAM stacks.
  ...
  All high-speed communication between the GPU and memory happens across the interposer instead. Because the interposer is a silicon chip, it's much denser, with many more connections and traces in a given area than an off-chip package."
  [link]

  Másik cikk a HBM-ről, ez az idézet csak Jack@l kedvéért:

  "High end current devices tend to have a 384b or 512b wide GDDR5 bus with each GDDR5 device being 32b wide. To make up for this disparity GDDR5 runs at a very high-speed, up to 7Gbps vs 1Gbps for HBM. In short for a given width, GDDR5 is ~7x faster than HBM, so why use HBM? Power, memory cost, power, implementation cost, power, board cost, power, and the fact that you probably couldn’t actually make a single device with a 1024b wide GDDR5 interface for anything approaching a sane cost. "

  Путин, иди нахуй!

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